Vol. 2, Issue 1, 2005January 01, 2005 EDT
Modified-Amine Cured Epoxy Formulation For The Encapsulation Of Electronic Circuits
Modified-Amine Cured Epoxy Formulation For The Encapsulation Of Electronic Circuits
Rinaldi, Gilberto, Alessia Catalani, Giulio Rubini, and Daniele Surace. 2005. “Modified-Amine Cured Epoxy Formulation For The Encapsulation Of Electronic Circuits.” Journal of Microelectronics and Electronic Packaging 2 (1): 55–63. https://doi.org/10.4071/1551-4897-2.1.55.