Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages

Schambeck, Simon, Matthias Hutter, Johannes Jaeschke, Andrea Deutinger, and Martin Schneider-Ramelow. 2020. “Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages.” Journal of Microelectronics and Electronic Packaging 17 (1): 13–22. https:/​/​doi.org/​10.4071/​imaps.966816.