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Vol. 17, Issue 1, 2020January 01, 2020 EDT

Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages

Simon Schambeck, Matthias Hutter, Johannes Jaeschke, Andrea Deutinger, Martin Schneider-Ramelow,
Temperature cyclingsolder joint reliabilitysolder fatiguemicrostructurechip-scale package
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.966816
Journal of Microelectronics & Elect Pkg
Schambeck, Simon, Matthias Hutter, Johannes Jaeschke, Andrea Deutinger, and Martin Schneider-Ramelow. 2020. “Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages.” Journal of Microelectronics and Electronic Packaging 17 (1): 13–22. https:/​/​doi.org/​10.4071/​imaps.966816.
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