ISSN 1551-4897
Vol. 17, Issue 1, 2020January 01, 2020 EDT
Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages
Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages
Articles in Vol. 17, Issue 1, 2020
Vol. 17, Issue 1, 2020
- Cu Pillar Bump Development for 7-nm Chip Package Interaction (CPI) TechnologyLei FuMilind BhagavatCheryl SelvanayagamKen LeongIvor Barber
- Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale PackagesSimon SchambeckMatthias HutterJohannes JaeschkeAndrea DeutingerMartin Schneider-Ramelow
- A Technique for Detecting Moisture Absorption in Printed Circuit BoardsJeffery D. CravenAriel R. OldagRobert N. Dean
- High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding ApplicationsYuan ZhaoDoug KatzeJohn WoodBruno TollaHoward Yun
- Synthesis and Characterization of Physical Properties of MgO Thin Films by Various ConcentrationsNadjat ChaouchSaid BenramacheSaid Lakel
Schambeck, Simon, Matthias Hutter, Johannes Jaeschke, Andrea Deutinger, and Martin Schneider-Ramelow. 2020. “Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages.” Journal of Microelectronics and Electronic Packaging 17 (1): 13–22. https://doi.org/10.4071/imaps.966816.