ISSN 1551-4897
Vol. 17, Issue 1, 2020January 01, 2020 EDT
Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages
Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages
Schambeck, Simon, Matthias Hutter, Johannes Jaeschke, Andrea Deutinger, and Martin Schneider-Ramelow. 2020. “Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages.” Journal of Microelectronics and Electronic Packaging 17 (1): 13–22. https://doi.org/10.4071/imaps.966816.