Vol. 17, Issue 4, 2020October 01, 2020 EDT
Optimization of PCB SI Coupon Design That Minimizes Discontinuity Through via-in-Pad Plated over (VIPPO) Technique
Optimization of PCB SI Coupon Design That Minimizes Discontinuity Through via-in-Pad Plated over (VIPPO) Technique
Lee, Juhee, Kyeongsoo Kim, Simon Kim, Kiseop Kim, and Kyungsoo Lee. 2020. “Optimization of PCB SI Coupon Design That Minimizes Discontinuity Through Via-in-Pad Plated over (VIPPO) Technique.” Journal of Microelectronics and Electronic Packaging 17 (4): 128–37. https://doi.org/10.4071/imaps.1227889.