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Vol. 17, Issue 4, 2020October 01, 2020 EDT

Optimization of PCB SI Coupon Design That Minimizes Discontinuity Through via-in-Pad Plated over (VIPPO) Technique

Juhee Lee, Kyeongsoo Kim, Simon Kim, Kiseop Kim, Kyungsoo Lee,
Delta-LVia discontinuityVIPPOSI couponPCB
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.1227889
Journal of Microelectronics & Elect Pkg
Lee, Juhee, Kyeongsoo Kim, Simon Kim, Kiseop Kim, and Kyungsoo Lee. 2020. “Optimization of PCB SI Coupon Design That Minimizes Discontinuity Through Via-in-Pad Plated over (VIPPO) Technique.” Journal of Microelectronics and Electronic Packaging 17 (4): 128–37. https:/​/​doi.org/​10.4071/​imaps.1227889.
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