Vol. 18, Issue 2, 2021April 01, 2021 EDT
Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration
Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration
Lau, John H, Cheng-Ta Ko, Chia-Yu Peng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, Jean-Jou Chen, et al. 2021. “Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration.” Journal of Microelectronics and Electronic Packaging 18 (2): 29–39. https://doi.org/10.4071/imaps.1419800.