Vol. 2, Issue 1, 2005January 01, 2005 EDT
Lead-free Solder Joint Reliability – State of the Art and Perspectives
Lead-free Solder Joint Reliability – State of the Art and Perspectives
Pan, Jianbiao, Jyhwen Wang, and David M. Shaddock. 2005. “Lead-Free Solder Joint Reliability – State of the Art and Perspectives.” Journal of Microelectronics and Electronic Packaging 2 (1): 72–83. https://doi.org/10.4071/1551-4897-2.1.72.