Thermal Cycling Test and Simulation of Six-Side Molded Panel-Level Chip-Scale Packages (PLCSPs)

Lau, John H, Cheng-Ta Ko, Chia-Yu Peng, Tzvy-Jang Tseng, Kai-Ming Yang, Tim Xia, Puru Bruce Lin, et al. 2021. “Thermal Cycling Test and Simulation of Six-Side Molded Panel-Level Chip-Scale Packages (PLCSPs).” Journal of Microelectronics and Electronic Packaging 18 (2): 67–80. https://doi.org/10.4071/imaps.1421341.