Vol. 17, Issue 2, 2020April 01, 2020 EDT
High-Temperature Electronics Packaging for Simulated Venus Condition
High-Temperature Electronics Packaging for Simulated Venus Condition
Nasiri, Ardalan, Simon S. Ang, Tom Cannon, Errol V. Porter, Kaoru Uema Porter, Caitlin Chapin, Ruiqi Chen, and Debbie G. Senesky. 2020. “High-Temperature Electronics Packaging for Simulated Venus Condition.” Journal of Microelectronics and Electronic Packaging 17 (2): 59–66. https://doi.org/10.4071/imaps.1115241.