High-Temperature Electronics Packaging for Simulated Venus Condition

Ardalan Nasiri; Simon S. Ang; Tom Cannon; Errol V. Porter; Kaoru Uema Porter; Caitlin Chapin; Ruiqi Chen; Debbie G. Senesky

doi:10.4071/imaps.1115241

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Nasiri, Ardalan, Simon S. Ang, Tom Cannon, Errol V. Porter, Kaoru Uema Porter, Caitlin Chapin, Ruiqi Chen, and Debbie G. Senesky. 2020. “High-Temperature Electronics Packaging for Simulated Venus Condition.” Journal of Microelectronics and Electronic Packaging 17 (2): 59–66. https://doi.org/10.4071/imaps.1115241.

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