Cu Pillar Bump Development for 7-nm Chip Package Interaction (CPI) Technology

Lei Fu; Milind Bhagavat; Cheryl Selvanayagam; Ken Leong; Ivor Barber

doi:10.4071/imaps.968260

Fu, Lei, Milind Bhagavat, Cheryl Selvanayagam, Ken Leong, and Ivor Barber. 2020. “Cu Pillar Bump Development for 7-Nm Chip Package Interaction (CPI) Technology.” Journal of Microelectronics and Electronic Packaging 17 (1): 1–8. https://doi.org/10.4071/imaps.968260.

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