Moisture-Resistant Sealing Materials for Downhole HPHT Electrical Feedthrough Package

Hua Xia; Nelson Settles; David DeWire

doi:10.4071/imaps.942864

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Xia, Hua, Nelson Settles, and David DeWire. 2019. “Moisture-Resistant Sealing Materials for Downhole HPHT Electrical Feedthrough Package.” Journal of Microelectronics and Electronic Packaging 16 (3): 141–48. https://doi.org/10.4071/imaps.942864.

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