Vol. 4, Issue 3, 2007July 01, 2007 EDT
High-Temperature Spin-On Adhesives for Temporary Wafer Bonding
High-Temperature Spin-On Adhesives for Temporary Wafer Bonding
Pillalamarri, S., R. Puligadda, C. Brubaker, M. Wimplinger, and S. Pargfrieder. 2007. “High-Temperature Spin-On Adhesives for Temporary Wafer Bonding.” Journal of Microelectronics and Electronic Packaging 4 (3): 105–11. https://doi.org/10.4071/1551-4897-4.3.105.