Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package

John Lau; Todd Castello; Dongkai Shangguan; Walter Dauksher; Joe Smetana; Rob Horsley; Dave Love; Irv Menis; Bob Sullivan

doi:10.4071/1551-4897-4.3.112

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Lau, John, Todd Castello, Dongkai Shangguan, Walter Dauksher, Joe Smetana, Rob Horsley, Dave Love, Irv Menis, and Bob Sullivan. 2007. “Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package.” Journal of Microelectronics and Electronic Packaging 4 (3): 112–20. https://doi.org/10.4071/1551-4897-4.3.112.

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