Vol. 4, Issue 3, 2007July 01, 2007 EDT
Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package
Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package
Lau, John, Todd Castello, Dongkai Shangguan, Walter Dauksher, Joe Smetana, Rob Horsley, Dave Love, Irv Menis, and Bob Sullivan. 2007. “Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package.” Journal of Microelectronics and Electronic Packaging 4 (3): 112–20. https://doi.org/10.4071/1551-4897-4.3.112.