ISSN 1551-4897
Vol. 4, Issue 3, 2007July 01, 2007 EDT
Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package
Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package
Articles in Vol. 4, Issue 3, 2007
Vol. 4, Issue 3, 2007
- High-Temperature Spin-On Adhesives for Temporary Wafer BondingS. PillalamarriR. PuligaddaC. BrubakerM. WimplingerS. Pargfrieder
- Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) PackageJohn LauTodd CastelloDongkai ShangguanWalter DauksherJoe SmetanaRob HorsleyDave LoveIrv MenisBob Sullivan
- Design and Optimization of Piezoelectric Fans for Cooling of Microelectronic DevicesMaram Venkata RamanaIndra Putra AlmanarMohd Zulkifly AbdullahZaidi Mohd RipinK.N. Seetaramu
- New Sacrificial Layer-Based Screen-Printing Process for Free-Standing Thick-Films Applied to MEMSClaude LucatPatrick GinetFrancis Ménil
- Nanoceramic Processing for High-Power Multi-channel Electron Multiplier in Low Temperature Cofire Ceramic (LTCC)Feng ZhengW. Kinzy JonesWenzhong WuRaghunandan Seelaboyina
- Comparison of High-Resolution Patterning Technologies for LTCC Microwave CircuitsJ. MüllerR. PerroneK.-H. DrüeR. StephanJ. TrabertM. HeinD. SchwankeJ. PohlnerG. ReppeR. KulkeP. UhligA.F. JacobT. BarasA. Molke
Lau, John, Todd Castello, Dongkai Shangguan, Walter Dauksher, Joe Smetana, Rob Horsley, Dave Love, Irv Menis, and Bob Sullivan. 2007. “Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package.” Journal of Microelectronics and Electronic Packaging 4 (3): 112–20. https://doi.org/10.4071/1551-4897-4.3.112.