Vol. 3, Issue 4, 2006October 01, 2006 EDT
Acceleration Factor to relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array Packages
Acceleration Factor to relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array Packages
Perkins, Andy, Krishna Tunga, and Suresh Sitaraman. 2006. “Acceleration Factor to Relate Thermal Cycles to Power Cycles for Ceramic Ball Grid Area Array Packages.” Journal of Microelectronics and Electronic Packaging 3 (4): 177–93. https://doi.org/10.4071/1551-4897-3.4.177.