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Vol. 2, Issue 4, 2005October 01, 2005 EDT

Thermal Design Optimization of Optoelectronic Package

N. Aizar A. Karim, P.A. Aswatha Narayana, K.N. Seetharamu,
Junction to pin thermal resistancejunction to ambient thermal resistancecomputational fluid dynamiclight-emitting diodebond line thickness
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-2.4.232
Journal of Microelectronics & Elect Pkg
Karim, N. Aizar A., P.A. Aswatha Narayana, and K.N. Seetharamu. 2005. “Thermal Design Optimization of Optoelectronic Package.” Journal of Microelectronics and Electronic Packaging 2 (4): 232–39. https:/​/​doi.org/​10.4071/​1551-4897-2.4.232.
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