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Vol. 2, Issue 2, 2005April 01, 2005 EDT

Progress in the Integration of planar and 3D Coils on LTCC by using photoimageable Inks

Rubén Perrone, Heiko Thust, Karl-Heinz Drüe,
LTCCFodel® -inksplanar-and 3-D coilsRF-Properties
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-2.2.155
Journal of Microelectronics & Elect Pkg
Perrone, Rubén, Heiko Thust, and Karl-Heinz Drüe. 2005. “Progress in the Integration of Planar and 3D Coils on LTCC by Using Photoimageable Inks.” Journal of Microelectronics and Electronic Packaging 2 (2): 155–61. https:/​/​doi.org/​10.4071/​1551-4897-2.2.155.
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