ISSN 1551-4897
Vol. 2, Issue 2, 2005April 01, 2005 EDT
Progress in the Integration of planar and 3D Coils on LTCC by using photoimageable Inks
Progress in the Integration of planar and 3D Coils on LTCC by using photoimageable Inks
Articles in Vol. 2, Issue 2, 2005
Vol. 2, Issue 2, 2005
- Analysis and Optimization Of Single Layer Counter Flow Micro-Channel Heat SinkK. JeevanK. N. SeetharamuI. A. Azid
- Engineering Model for Interfacial Stresses of a Heated Bimaterial Structure with Bond Material Used in Electronic PackagesD. SujanM. V. V. MurthyK. N. SeetharamuA. Y. Hassan
- Low Temperature Rapid Curing of Polymer Dielectrics on Metallized Organic Laminates by Variable Frequency Microwave ProcessingTaehyun SungSue A. Bidstrup AllenPaul A. Kohl
- Progress in the Integration of planar and 3D Coils on LTCC by using photoimageable InksRubén PerroneHeiko ThustKarl-Heinz Drüe
- Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 2Cheang Soon YeeG.A. QuadirZ.A. ZainalK.N. Seetharamu
- Two-Phase Stacked Microchannel Heat Sinks for Microelectronics CoolingPradeep HegdeK.N. SeetharamuP.A. Aswatha NarayanaZulkifly Abdullah
Perrone, Rubén, Heiko Thust, and Karl-Heinz Drüe. 2005. “Progress in the Integration of Planar and 3D Coils on LTCC by Using Photoimageable Inks.” Journal of Microelectronics and Electronic Packaging 2 (2): 155–61. https://doi.org/10.4071/1551-4897-2.2.155.