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Vol. 18, Issue 3, 2021July 01, 2021 EDT

Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to an Ag-Pd-Pt Thick Film Metallization: Part 1—Processing Effects

Paul T. Vianco, Alice C. Kilgo, Bonnie B. McKenzie, Shelley Williams, Robert Ferrizz, Curtis Co,
Hybrid microcircuitslead-free solderthick film conductorstrengthprocess development
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.1435232
Journal of Microelectronics & Elect Pkg
Vianco, Paul T., Alice C. Kilgo, Bonnie B. McKenzie, Shelley Williams, Robert Ferrizz, and Curtis Co. 2021. “Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to an Ag-Pd-Pt Thick Film Metallization: Part 1—Processing Effects.” Journal of Microelectronics and Electronic Packaging 18 (3): 81–96. https:/​/​doi.org/​10.4071/​imaps.1435232.
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