This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
Journal of Microelectronics & Elect Pkg
  • Menu
  • Articles
    • General
    • Technical Article
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • IMAPSource Proceedings
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:34495/feed
ISSN 1551-4897
General
Vol. 18, Issue 3, 2021July 01, 2021 EDT

Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to an Ag-Pd-Pt Thick Film Metallization: Part 1—Processing Effects

Paul T. Vianco, Alice C. Kilgo, Bonnie B. McKenzie, Shelley Williams, Robert Ferrizz, Curtis Co,
Hybrid microcircuitslead-free solderthick film conductorstrengthprocess development
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.1435232
Journal of Microelectronics & Elect Pkg
Vianco, Paul T., Alice C. Kilgo, Bonnie B. McKenzie, Shelley Williams, Robert Ferrizz, and Curtis Co. 2021. “Mechanical Properties and Interface Microstructure of SAC305 Solder Joints Made to an Ag-Pd-Pt Thick Film Metallization: Part 1—Processing Effects.” Journal of Microelectronics and Electronic Packaging 18 (3): 81–96. https:/​/​doi.org/​10.4071/​imaps.1435232.

View more stats

Powered by Scholastica, the modern academic journal management system