Vol. 18, Issue 4, 2021October 01, 2021 EDT
State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding
State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding
Lau, John H. 2021. “State-of-the-Art and Outlooks of Chiplets Heterogeneous Integration and Hybrid Bonding.” Journal of Microelectronics and Electronic Packaging 18 (4): 145–60. https://doi.org/10.4071/imaps.1542066.