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Vol. 19, Issue 4, 2022October 01, 2022 EDT

Composite Soldering Materials Based on BiSnAg for High-Temperature Stable Solder Joints

Andrej Novikov, Mathias Nowottnick,
Diffusion solderinglow-temperature soldersintermetallic phases
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.1823306
Journal of Microelectronics & Elect Pkg
Novikov, Andrej, and Mathias Nowottnick. 2022. “Composite Soldering Materials Based on BiSnAg for High-Temperature Stable Solder Joints.” Journal of Microelectronics and Electronic Packaging 19 (4): 115–22. https:/​/​doi.org/​10.4071/​imaps.1823306.
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