Vol. 19, Issue 4, 2022October 01, 2022 EDT
Composite Soldering Materials Based on BiSnAg for High-Temperature Stable Solder Joints
Composite Soldering Materials Based on BiSnAg for High-Temperature Stable Solder Joints
Novikov, Andrej, and Mathias Nowottnick. 2022. “Composite Soldering Materials Based on BiSnAg for High-Temperature Stable Solder Joints.” Journal of Microelectronics and Electronic Packaging 19 (4): 115–22. https://doi.org/10.4071/imaps.1823306.