Electromigration Risk Assessment and Circuit Optimization Using Innovative Multiphysics Modeling

Chongyang Cai; Zhi Yang; Yuan Li; Padam Jain; Terry Kang; Krishna Mellachervu

doi:10.4071/imaps.1882247

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Cai, Chongyang, Zhi Yang, Yuan Li, Padam Jain, Terry Kang, and Krishna Mellachervu. 2023. “Electromigration Risk Assessment and Circuit Optimization Using Innovative Multiphysics Modeling.” Journal of Microelectronics and Electronic Packaging 20 (1): 9–16. https://doi.org/10.4071/imaps.1882247.

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