ISSN 1551-4897
Vol. 20, Issue 1, 2023January 01, 2023 EDT
Electromigration Risk Assessment and Circuit Optimization Using Innovative Multiphysics Modeling
Electromigration Risk Assessment and Circuit Optimization Using Innovative Multiphysics Modeling
Cai, Chongyang, Zhi Yang, Yuan Li, Padam Jain, Terry Kang, and Krishna Mellachervu. 2023. “Electromigration Risk Assessment and Circuit Optimization Using Innovative Multiphysics Modeling.” Journal of Microelectronics and Electronic Packaging 20 (1): 9–16. https://doi.org/10.4071/imaps.1882247.