Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability

Ashish S. Salunke; John Alptekin; Kaushik Akula; Subiksha Jayakumar; Shaurya Kumar; Oliver Chyan

doi:10.4071/imaps.1903845

Loading [Contrib]/a11y/accessibility-menu.js

Salunke, Ashish S., John Alptekin, Kaushik Akula, Subiksha Jayakumar, Shaurya Kumar, and Oliver Chyan. 2023. “Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability.” Journal of Microelectronics and Electronic Packaging 20 (1): 17–26. https://doi.org/10.4071/imaps.1903845.

View more stats