Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability

Salunke, Ashish S., John Alptekin, Kaushik Akula, Subiksha Jayakumar, Shaurya Kumar, and Oliver Chyan. 2023. “Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability.” Journal of Microelectronics and Electronic Packaging 20 (1): 17–26. https:/​/​doi.org/​10.4071/​imaps.1903845.