ISSN 1551-4897
Vol. 20, Issue 1, 2023January 01, 2023 EDT
A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue Modeling
A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue Modeling
Articles in Vol. 20, Issue 1, 2023
Vol. 20, Issue 1, 2023
- AlGaN High Electron Mobility Transistor for High-Temperature LogicB. A. KleinA. A. AllermanA. G. BacaC. D. NordquistA. M. ArmstrongM. Van HeukelomA. RiceV. PatelM. RosprimL. CaravelloR. DeBerryJ. R. PipkinV. M. AbateR. J. Kaplar
- Electromigration Risk Assessment and Circuit Optimization Using Innovative Multiphysics ModelingChongyang CaiZhi YangYuan LiPadam JainTerry KangKrishna Mellachervu
- Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance ReliabilityAshish S. SalunkeJohn AlptekinKaushik AkulaSubiksha JayakumarShaurya KumarOliver Chyan
- A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue ModelingSean BrinleeScott Popelar
- Study on CPI Behaviors of X Dimension Fan-Out Integration (XDFOI) PackagesHaijie ChenZhen HuMing HeJielei XieYaojian LinChoon Heung Lee
Brinlee, Sean, and Scott Popelar. 2023. “A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue Modeling.” Journal of Microelectronics and Electronic Packaging 20 (1): 27–35. https://doi.org/10.4071/imaps.1939648.