Vol. 20, Issue 1, 2023January 01, 2023 EDT
A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue Modeling
A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue Modeling
Brinlee, Sean, and Scott Popelar. 2023. “A Physics-of-Failure Investigation of Flip Chip Reliability Based on Lead-Free Solder Fatigue Modeling.” Journal of Microelectronics and Electronic Packaging 20 (1): 27–35. https://doi.org/10.4071/imaps.1939648.