Vol. 20, Issue 1, 2023January 01, 2023 EDT
Study on CPI Behaviors of X Dimension Fan-Out Integration (XDFOI) Packages
Study on CPI Behaviors of X Dimension Fan-Out Integration (XDFOI) Packages
Chen, Haijie, Zhen Hu, Ming He, Jielei Xie, Yaojian Lin, and Choon Heung Lee. 2023. “Study on CPI Behaviors of X Dimension Fan-Out Integration (XDFOI) Packages.” Journal of Microelectronics and Electronic Packaging 20 (1): 36–42. https://doi.org/10.4071/imaps.1926257.