Study on CPI Behaviors of X Dimension Fan-Out Integration (XDFOI) Packages

Haijie Chen; Zhen Hu; Ming He; Jielei Xie; Yaojian Lin; Choon Heung Lee

doi:10.4071/imaps.1926257

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Chen, Haijie, Zhen Hu, Ming He, Jielei Xie, Yaojian Lin, and Choon Heung Lee. 2023. “Study on CPI Behaviors of X Dimension Fan-Out Integration (XDFOI) Packages.” Journal of Microelectronics and Electronic Packaging 20 (1): 36–42. https://doi.org/10.4071/imaps.1926257.

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