ISSN 1551-4897
Articles in Vol. 20, Issue 2, 2023
Vol. 20, Issue 2, 2023
- State-of-the-Art in Chiplets Horizontal CommunicationsJohn H. Lau
- Investigation into Impact of Redistribution Layer Design on Thermomechanical Stress in Embedded-Die PackageMasamitsu MatsuuraTanemasa AsanoHaruichi Kanaya
- Double-Sided Integrated GaN Power Module with Double Pulse Test (DPT) VerificationSourish S. SinhaTzu-Hsuan ChengDouglas C. Hopkins
- A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete ApplicationsHongwen ZhangTyler RichmondKyle AserianSamuel LytwynecTybarius HarterDiego Prado
Lau, John H. 2023. “State-of-the-Art in Chiplets Horizontal Communications.” Journal of Microelectronics and Electronic Packaging 20 (2): 43–64. https://doi.org/10.4071/001c.81977.