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Vol. 20, Issue 2, 2023
April 01, 2023 EDT
State-of-the-Art in Chiplets Horizontal Communications
John H. Lau
,
chiplets
heterogeneous integration
bridges
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https://doi.org/10.4071/001c.81977
Journal of Microelectronics & Elect Pkg
Lau, John H. 2023. “State-of-the-Art in Chiplets Horizontal Communications.”
Journal of Microelectronics and Electronic Packaging
20 (2): 43–64.
https://doi.org/10.4071/001c.81977
.
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