Vol. 20, Issue 2, 2023April 01, 2023 EDT
Investigation into Impact of Redistribution Layer Design on Thermomechanical Stress in Embedded-Die Package
Investigation into Impact of Redistribution Layer Design on Thermomechanical Stress in Embedded-Die Package
Matsuura, Masamitsu, Tanemasa Asano, and Haruichi Kanaya. 2023. “Investigation into Impact of Redistribution Layer Design on Thermomechanical Stress in Embedded-Die Package.” Journal of Microelectronics and Electronic Packaging 20 (2): 65–70. https://doi.org/10.4071/001c.81979.