Vol. 20, Issue 2, 2023April 01, 2023 EDT
A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications
A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications
Zhang, Hongwen, Tyler Richmond, Kyle Aserian, Samuel Lytwynec, Tybarius Harter, and Diego Prado. 2023. “A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications.” Journal of Microelectronics and Electronic Packaging 20 (2): 82` – 87. https://doi.org/10.4071/001c.81981.