ISSN 1551-4897
Vol. 20, Issue 3, 2023July 01, 2023 EDT
Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications
Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications
Lyon, Benjamin, and Christina DiMarino. 2023. “Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications.” Journal of Microelectronics and Electronic Packaging 20 (3): 89–94. https://doi.org/10.4071/001c.88421.