Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications

Benjamin Lyon; Christina DiMarino

doi:10.4071/001c.88421

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Lyon, Benjamin, and Christina DiMarino. 2023. “Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications.” Journal of Microelectronics and Electronic Packaging 20 (3): 89–94. https://doi.org/10.4071/001c.88421.

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