ISSN 1551-4897
Vol. 20, Issue 3, 2023July 01, 2023 EDT
Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications
Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications
Articles in Vol. 20, Issue 3, 2023
Vol. 20, Issue 3, 2023
- Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module ApplicationsBenjamin LyonChristina DiMarino
- A Hybrid Pressureless Silver Sintering Technology for High-Power Density ElectronicsYuan ZhaoBruno TollaDoug KatzeGlenda CastanedaJo-Anne WilsonDavid Brand
- An Evaluation on the Mechanical and Conductive Performance of Electrically Conductive Film Adhesives with Glass Fabric CarriersWeiyu ZhangYuan ZhaoZhongwei LiuStone Cheng
Lyon, Benjamin, and Christina DiMarino. 2023. “Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications.” Journal of Microelectronics and Electronic Packaging 20 (3): 89–94. https://doi.org/10.4071/001c.88421.