ISSN 1551-4897
Vol. 20, Issue 3, 2023July 01, 2023 EDT
A Hybrid Pressureless Silver Sintering Technology for High-Power Density Electronics
A Hybrid Pressureless Silver Sintering Technology for High-Power Density Electronics
Articles in Vol. 20, Issue 3, 2023
Vol. 20, Issue 3, 2023
- Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module ApplicationsBenjamin LyonChristina DiMarino
- A Hybrid Pressureless Silver Sintering Technology for High-Power Density ElectronicsYuan ZhaoBruno TollaDoug KatzeGlenda CastanedaJo-Anne WilsonDavid Brand
- An Evaluation on the Mechanical and Conductive Performance of Electrically Conductive Film Adhesives with Glass Fabric CarriersWeiyu ZhangYuan ZhaoZhongwei LiuStone Cheng
Zhao, Yuan, Bruno Tolla, Doug Katze, Glenda Castaneda, Jo-Anne Wilson, and David Brand. 2023. “A Hybrid Pressureless Silver Sintering Technology for High-Power Density Electronics.” Journal of Microelectronics and Electronic Packaging 20 (3): 95–100. https://doi.org/10.4071/001c.88422.