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Vol. 20, Issue 3, 2023July 01, 2023 EDT

An Evaluation on the Mechanical and Conductive Performance of Electrically Conductive Film Adhesives with Glass Fabric Carriers

Weiyu Zhang, Yuan Zhao, Zhongwei Liu, Stone Cheng,
Assembly film adhesivesRF power devicesthermal management
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/001c.88424
Journal of Microelectronics & Elect Pkg
Zhang, Weiyu, Yuan Zhao, Zhongwei Liu, and Stone Cheng. 2023. “An Evaluation on the Mechanical and Conductive Performance of Electrically Conductive Film Adhesives with Glass Fabric Carriers.” Journal of Microelectronics and Electronic Packaging 20 (3): 101–6. https:/​/​doi.org/​10.4071/​001c.88424.
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