ISSN 1551-4897
Vol. 20, Issue 4, 2023October 01, 2023 EDT
Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules
David Huitink, Whit Vinson, Collin Ruby, Imam Al Razi, David Agogo-Mawuli, Alan Mantooth, Yarui Peng,
Articles in Vol. 20, Issue 4, 2023
Vol. 20, Issue 4, 2023
- Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power ModulesDavid HuitinkWhit VinsonCollin RubyImam Al RaziDavid Agogo-MawuliAlan MantoothYarui Peng
- Dual-Band Dual-Polarized Antennas for 5G mmWave Base StationsThi H. LeIvan NdipMartin Schneider-Ramelow
- A Novel Approach for Characterizing Epoxy Mold Compound High Temperature SwellingIan ChinWei Keat LohMohd Zulkifly Bin Abdullah
Huitink, David, Whit Vinson, Collin Ruby, Imam Al Razi, David Agogo-Mawuli, Alan Mantooth, and Yarui Peng. 2023. “Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules.” Journal of Microelectronics and Electronic Packaging 20 (4): 107–11. https://doi.org/10.4071/001c.91213.