Vol. 20, Issue 4, 2023October 01, 2023 EDT
A Novel Approach for Characterizing Epoxy Mold Compound High Temperature Swelling
A Novel Approach for Characterizing Epoxy Mold Compound High Temperature Swelling
Chin, Ian, Wei Keat Loh, and Mohd Zulkifly Bin Abdullah. 2023. “A Novel Approach for Characterizing Epoxy Mold Compound High Temperature Swelling.” Journal of Microelectronics and Electronic Packaging 20 (4): 123–29. https://doi.org/10.4071/001c.91225.