All Articles tagged Fatigue life
- General
October 01, 2008 EDT Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)The major concerns posed by system-in-package (SiP) designs for network applications are the interconnection reliability between the memory plastic ball grid array (PBGA) package and the SiP module, which we...
- General
January 01, 2008 EDT In modern automotive control modules, mechanical failures of surface-mounted electronic components such as microprocessors, crystals, capacitors, inductors, transformers, ball grid array packages (BGA), quad flat packages (QFP), and chip-scale packages...
- General
October 01, 2007 EDT Due to the high speed and high I/O count requirements for semiconductor packages, thousands of soldered interconnections are indispensable, and this situation renders traditional finite element method (FEM) analysis a...