All Articles tagged c = parameters defining the plane of the chip

• General
  April 01, 2004 EDT
  Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP’s
  Co van VeenBart VandeveldeEric Beyne

  Not only the stand-off height but also the shape of a solder joint has a strong influence on the joint reliability under temperature cycling. The shape determines the size of...

  Abstract