In the power semiconductor industry, there is continuous development toward higher maximum current capability of devices while device dimensions shrink. This leads to an increase in current density which the...
- General
- GeneralFor die-to-wafer (D2W) stacking of high-density interconnects and fine-pitch microbumps, underfill serves to fill the spaces in-between microbumps for protection and reliability. Among the different types of underfill, nonconductive film...
- GeneralComputational modeling is often leveraged to design and optimize electronic packages for both performance and reliability purposes. One of the factors that affect the accuracy of computational models is the...
- GeneralCu plating bath for high-speed electrodeposition of Cu pillar was designed in consideration of a flat top morphology of pillar and a pillar height uniformity. An ideal polarization curve was...