ISSN 1551-4897
Vol. 21, Issue 2, 2024April 01, 2024 EDT
Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding Reliability
Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding Reliability
Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, John Alptekin, Logan Estridge, Shyam Nair, Oliver Chyan,
Articles in Vol. 21, Issue 2, 2024
Vol. 21, Issue 2, 2024
- Flip-Chip-Based Dual-Polarized Antenna-on-Package Arrays for 5G mmWave ModulesThi Huyen LeIvan Ndip
- Unlocking the True Power of Additive Manufacturing for EMI ShieldingMarkus G. ScheibelMichael P. KaiserSutharsan BalasubramaniamMykola ChernobryvkoJulia-Marie KoszegiMarc DreissigackerMarius AdlerTanja BraunChuan I. Eric HuangMeng Jason LiMuriel ThomasFranz Vollmann
- Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding ReliabilityKevin Antony Jesu DuraiDinesh Kumar KumaravelJohn AlptekinLogan EstridgeShyam NairOliver Chyan
- Improved Throughput with Dynamic “Real-Time” Dual Head Dispensing in Electronics AssemblySunny Agarwal
Durai, Kevin Antony Jesu, Dinesh Kumar Kumaravel, John Alptekin, Logan Estridge, Shyam Nair, and Oliver Chyan. 2024. “Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding Reliability.” Journal of Microelectronics and Electronic Packaging 21 (2): 42–49. https://doi.org/10.4071/001c.119026.