ISSN 1551-4897
Vol. 1, Issue 4, 2004October 01, 2004 EDT
Investigation of Delamination Between Leadframe and Mold Compound on a LED Package
Investigation of Delamination Between Leadframe and Mold Compound on a LED Package
Articles in Vol. 1, Issue 4, 2004
Vol. 1, Issue 4, 2004
- Simulation of Balanced Mold Filling in Transfer Molding for Newtonian FluidsChu Wee LiangVenkatesh M. KulkarniP.A.A. Aswataha NarayanaK.N. Seetharamu
- Spiral Inductors with Multi-Strip Coils Processed on Sapphire and Bulk Silicon SubstratesPäivi H. KarjalainenJuha RapeloEero O. Ristolainen
- Research on Power Electronic Integrated Module for SMPsChen QiaoliangZeng XiangjunYang XuWang Zhaoan
- Self-packaged Boron Nitride Capacitor for High Temperature ApplicationsN. BadiC. BoneyA. Bensaoula
- Three Dimensional CFD Conjugate Analysis of Two Inline PLCC Packages Horizontally MountedB. JayakumarG. A. QuadirM. Z. AbdullahK. N. Seetharamu
- Mechanical Reinforcement for Sphere Attach ApplicationsMaureen BrownRichard JungJin LiuJohn StippAmir FattahianSandy Shashipadme
- Electrical Resistance of Laser Sintered Direct-Write Deposited Materials for Microelectronic ApplicationsValery R. Marinov
- Investigation of Delamination Between Leadframe and Mold Compound on a LED PackageFu-Mauh WongK.N Seetharamu
- Study of Laser Microdrilling for Applications in Microelectronics and PackagingWei HanRyszard J. Pryputniewicz
Wong, Fu-Mauh, and K.N Seetharamu. 2004. “Investigation of Delamination Between Leadframe and Mold Compound on a LED Package.” Journal of Microelectronics and Electronic Packaging 1 (4): 269–81. https://doi.org/10.4071/1551-4897-1.4.269.