ISSN 1551-4897
Vol. 10, Issue 1, 2013January 01, 2013 EDT
Development of High Dielectric Strength Ceramic Film Capacitors for Advanced Power Electronics
Development of High Dielectric Strength Ceramic Film Capacitors for Advanced Power Electronics
Articles in Vol. 10, Issue 1, 2013
Vol. 10, Issue 1, 2013
- The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with DesiccantNathaniel DahanNick DonaldsonStephen TaylorNuno Sereno
- Development of High Dielectric Strength Ceramic Film Capacitors for Advanced Power ElectronicsBeihai MaManoj NarayananShanshan LiuSheng TongU. (Balu) Balachandran
- Tunability, Frequency, and Temperature Behavior of Cofired LTCC-Integrated Barium-Strontium-Titanate Shunt Capacitors up to 8 GHzSven RentschJens MüllerMatthias Hein
- Utilizing Modeling in a Reliability Study of ACA Joints in Humidity TestsKirsi SaarinenLaura Frisk
- Multiobjective Design Optimization of Microchannel Cooling System Using High Performance Thermal Vias in LTCC SubstratesAparna AravelliSingiresu S. RaoHari K. Adluru
- Design and Robustness of Quilt Packaging SuperconnectM. Ashraf KhanJason M. KulickDavid KoppPatrick FayAlfred M. KrimanGary H. Bernstein
Ma, Beihai, Manoj Narayanan, Shanshan Liu, Sheng Tong, and U. (Balu) Balachandran. 2013. “Development of High Dielectric Strength Ceramic Film Capacitors for Advanced Power Electronics.” Journal of Microelectronics and Electronic Packaging 10 (1): 1–7. https://doi.org/10.4071/imaps.369.