ISSN 1551-4897
Vol. 10, Issue 1, 2013January 01, 2013 EDT
Utilizing Modeling in a Reliability Study of ACA Joints in Humidity Tests
Utilizing Modeling in a Reliability Study of ACA Joints in Humidity Tests
Articles in Vol. 10, Issue 1, 2013
Vol. 10, Issue 1, 2013
- The Application of PEEK to the Packaging of Implantable Electronic Devices: Water Permeation Calculation Method and Maximum Achievable Lifetime with DesiccantNathaniel DahanNick DonaldsonStephen TaylorNuno Sereno
- Development of High Dielectric Strength Ceramic Film Capacitors for Advanced Power ElectronicsBeihai MaManoj NarayananShanshan LiuSheng TongU. (Balu) Balachandran
- Tunability, Frequency, and Temperature Behavior of Cofired LTCC-Integrated Barium-Strontium-Titanate Shunt Capacitors up to 8 GHzSven RentschJens MüllerMatthias Hein
- Utilizing Modeling in a Reliability Study of ACA Joints in Humidity TestsKirsi SaarinenLaura Frisk
- Multiobjective Design Optimization of Microchannel Cooling System Using High Performance Thermal Vias in LTCC SubstratesAparna AravelliSingiresu S. RaoHari K. Adluru
- Design and Robustness of Quilt Packaging SuperconnectM. Ashraf KhanJason M. KulickDavid KoppPatrick FayAlfred M. KrimanGary H. Bernstein
Saarinen, Kirsi, and Laura Frisk. 2013. “Utilizing Modeling in a Reliability Study of ACA Joints in Humidity Tests.” Journal of Microelectronics and Electronic Packaging 10 (1): 30–39. https://doi.org/10.4071/imaps.350.