ISSN 1551-4897
Vol. 10, Issue 2, 2013April 01, 2013 EDT
Development of Silver Nanoparticle Ink for Printed Electronics
Development of Silver Nanoparticle Ink for Printed Electronics
Articles in Vol. 10, Issue 2, 2013
Vol. 10, Issue 2, 2013
- Development of Silver Nanoparticle Ink for Printed ElectronicsYiliang WuPing LiuTony Wigglesworth
- Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond CompositeM. FaqirJ. W. PomeroyT. BattenT. MrotzekS. KnippscheerO. VendierS. RochetteM. MassiotL. LetteronJ. M. DesmarresF. CourtadeM. Kuball
- Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength ReliabilitySatoshi TanimotoKohei MatsuiYusuke ZushiShinji SatoYoshinori MurakamiMasato TakamoriTakashi Iseki
- High Temperature Characterization up to 450°C of MOSFETs and Basic Circuits Realized in a Silicon-on-Insulator (SOI) CMOS TechnologyK. GrellaS. DreinerA. SchmidtW. HeiermannH. KappertH. VogtU. Paschen
- Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment ElectronicsM. MirgkizoudiC. LiuP. P. ConwayS. Riches
- The Distribution and Transport of Alpha Activity in TinBrett M. Clark
Wu, Yiliang, Ping Liu, and Tony Wigglesworth. 2013. “Development of Silver Nanoparticle Ink for Printed Electronics.” Journal of Microelectronics and Electronic Packaging 10 (2): 49–53. https://doi.org/10.4071/imaps.365.