ISSN 1551-4897
Vol. 10, Issue 2, 2013April 01, 2013 EDT
Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability
Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability
Articles in Vol. 10, Issue 2, 2013
Vol. 10, Issue 2, 2013
- Development of Silver Nanoparticle Ink for Printed ElectronicsYiliang WuPing LiuTony Wigglesworth
- Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond CompositeM. FaqirJ. W. PomeroyT. BattenT. MrotzekS. KnippscheerO. VendierS. RochetteM. MassiotL. LetteronJ. M. DesmarresF. CourtadeM. Kuball
- Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength ReliabilitySatoshi TanimotoKohei MatsuiYusuke ZushiShinji SatoYoshinori MurakamiMasato TakamoriTakashi Iseki
- High Temperature Characterization up to 450°C of MOSFETs and Basic Circuits Realized in a Silicon-on-Insulator (SOI) CMOS TechnologyK. GrellaS. DreinerA. SchmidtW. HeiermannH. KappertH. VogtU. Paschen
- Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment ElectronicsM. MirgkizoudiC. LiuP. P. ConwayS. Riches
- The Distribution and Transport of Alpha Activity in TinBrett M. Clark
Tanimoto, Satoshi, Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori Murakami, Masato Takamori, and Takashi Iseki. 2013. “Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability.” Journal of Microelectronics and Electronic Packaging 10 (2): 59–66. https://doi.org/10.4071/imaps.373.