ISSN 1551-4897
Vol. 10, Issue 4, 2013October 01, 2013 EDT
Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections
Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections
Articles in Vol. 10, Issue 4, 2013
Vol. 10, Issue 4, 2013
- Tin Nanoparticle-Based Solder Paste for Low Temperature ProcessingAlfredo J. DiazDavid MaAlfred ZinnPedro O. Quintero
- High-Temperature Characterization and Comparison of 1.2 kV SiC Power Semiconductor DevicesChristina DiMarinoZheng ChenDushan BoroyevichRolando BurgosPaolo Mattavelli
- Surface Characteristics of LTCC Substrates Fabricated by Pressure-Assisted SinteringBjoern BrandtTorsten Rabe
- Reliability Investigations up to 350°C of Gate Oxide Capacitors Realized in a Silicon-on-Insulator CMOS TechnologyK. GrellaS. DreinerH. VogtU. Paschen
- Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond InterconnectionsS. T. RichesC. JohnstonA. Lui
- A 4H-SiC Bipolar Technology for High-Temperature Integrated CircuitsL. LanniB. G. MalmC.-M. ZetterlingM. Östling
- Enhanced High Temperature Performance of PD-SOI MOSFETs in Analog Circuits Using Reverse Body BiasingAlexander SchmidtHolger KappertRainer Kokozinski
Riches, S. T., C. Johnston, and A. Lui. 2013. “Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections.” Journal of Microelectronics and Electronic Packaging 10 (4): 163–70. https://doi.org/10.4071/imaps.392.