ISSN 1551-4897
Vol. 11, Issue 4, 2014October 01, 2014 EDT
Causality Verification Using Polynomial Periodic Continuations for Electrical Interconnects
Causality Verification Using Polynomial Periodic Continuations for Electrical Interconnects
Articles in Vol. 11, Issue 4, 2014
Vol. 11, Issue 4, 2014
- Thermal Cycling Reliability of Alternative Low-Silver Tin-Based SoldersElviz GeorgeMichael OstermanMichael PechtRichard CoyleRichard ParkerElizabeth Benedetto
- High Temperature Laminate CharacterizationDavid ShaddockLiang Yin
- Uniqueness and Challenges of Sintered Silver as a Bonded Interface MaterialA. A. WereszczakZ. LiangM. K. FerberL. D. Marlino
- Stacked Ceramic Capacitors for High Temperatures (≥200°C)John BultitudeLonnie JonesJohn McConnellAbhijit Gurav
- Causality Verification Using Polynomial Periodic Continuations for Electrical InterconnectsLyudmyla L. BarannykHazem A. AboutalebAicha ElshabiniFred Barlow
- Direct-Bond-Copper Switch Module for Management of Temperature and Noise in 220-W/in3 Power AssemblyWoochan KimJongwon ShinKhai D. T. Ngo
Barannyk, Lyudmyla L., Hazem A. Aboutaleb, Aicha Elshabini, and Fred Barlow. 2014. “Causality Verification Using Polynomial Periodic Continuations for Electrical Interconnects.” Journal of Microelectronics and Electronic Packaging 11 (4): 181–96. https://doi.org/10.4071/imaps.428.