ISSN 1551-4897
Vol. 11, Issue 3, 2014July 01, 2014 EDT
A Control-Chart-Based Method for Solder Joint Crack Detection
A Control-Chart-Based Method for Solder Joint Crack Detection
Articles in Vol. 11, Issue 3, 2014
Vol. 11, Issue 3, 2014
- A Modeling Approach for Predicting the Effects of Dielectric Moisture Absorption on the Electrical Performance of Passive StructuresBrian CurranIvan NdipEge EnginJorg BauerHarald PötterKlaus-Dieter LangHerbert Reichl
- Advanced Thermal Management Solutions on PCBs for High Power ApplicationsGregor LangerMarkus LeitgebJohann NicolicsMichael UngerHans HoschopfFranz P. Wenzl
- Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board TechnologyRobert N. DeanMichael C. HamiltonMichael E. Baginski
- Prolonging the Lifetime of PEEK Packages for Implantable Electronic Devices Using Commercially Available Vacuum Thin Film CoatingsNathaniel DahanNick DonaldsonStephen TaylorNuno Sereno
- A Control-Chart-Based Method for Solder Joint Crack DetectionJianbiao Pan
- Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical InterconnectsVladimir O. ChermanNga P. PhamJohn SlabbekoornAlessandro FaesBenno MargesinHarrie A.C. Tilmans
Pan, Jianbiao. 2014. “A Control-Chart-Based Method for Solder Joint Crack Detection.” Journal of Microelectronics and Electronic Packaging 11 (3): 94–103. https://doi.org/10.4071/imaps.423.