ISSN 1551-4897
Vol. 11, Issue 3, 2014July 01, 2014 EDT
Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects
Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects
Articles in Vol. 11, Issue 3, 2014
Vol. 11, Issue 3, 2014
- A Modeling Approach for Predicting the Effects of Dielectric Moisture Absorption on the Electrical Performance of Passive StructuresBrian CurranIvan NdipEge EnginJorg BauerHarald PötterKlaus-Dieter LangHerbert Reichl
- Advanced Thermal Management Solutions on PCBs for High Power ApplicationsGregor LangerMarkus LeitgebJohann NicolicsMichael UngerHans HoschopfFranz P. Wenzl
- Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board TechnologyRobert N. DeanMichael C. HamiltonMichael E. Baginski
- Prolonging the Lifetime of PEEK Packages for Implantable Electronic Devices Using Commercially Available Vacuum Thin Film CoatingsNathaniel DahanNick DonaldsonStephen TaylorNuno Sereno
- A Control-Chart-Based Method for Solder Joint Crack DetectionJianbiao Pan
- Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical InterconnectsVladimir O. ChermanNga P. PhamJohn SlabbekoornAlessandro FaesBenno MargesinHarrie A.C. Tilmans
Cherman, Vladimir O., Nga P. Pham, John Slabbekoorn, Alessandro Faes, Benno Margesin, and Harrie A.C. Tilmans. 2014. “Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects.” Journal of Microelectronics and Electronic Packaging 11 (3): 87–93. https://doi.org/10.4071/imaps.418.