ISSN 1551-4897
Vol. 12, Issue 4, 2015October 01, 2015 EDT
Review of Devices, Packaging, and Materials for Cryogenic Optoelectronics
Review of Devices, Packaging, and Materials for Cryogenic Optoelectronics
Articles in Vol. 12, Issue 4, 2015
Vol. 12, Issue 4, 2015
- Development of a Multifunctional Implantable Heart Monitoring DeviceAnh-Tuan T. NguyenFjodors TjulkinsKnut E. AasmundtveitNils HoivikLars HoffOle-Johannes GrymyrPer Steinar HalvorsenKristin Imenes
- Review of Devices, Packaging, and Materials for Cryogenic OptoelectronicsEivind BardalenMuhammad Nadeem AkramHelge MalmbekkPer Ohlckers
- High-Temperature Anisotropic Magnetoresistive (AMR) SensorsBharat B. PantLucky WithanawasamMike BohlingerMark LarsonBruce W. Ohme
- Process Optimization for 3-D IC AssemblyCharles G. WoychikSangil LeeScott McGrathSitaram Arkalgud
- Temperature Dependence of High Dielectric Strength Potting Materials for Medium Voltage Power ModulesChad B. O'NealMatthew FeurtadoJennifer StabachTy McNuttBrandon Passmore
- High-Temperature Reliability of Copper Wire-Bonded Packages Encapsulated with Mold Compounds Containing Sulfur CompoundsVarughese MathewSheila Chopin
- Fabrication and Characterization of Vibration and Wind Energy Harvesters Using Multilayer Free-Standing Piezoelectric Thick FilmsYang BaiHana HughesPavel TofelCarl MeggsTim W. Button
Bardalen, Eivind, Muhammad Nadeem Akram, Helge Malmbekk, and Per Ohlckers. 2015. “Review of Devices, Packaging, and Materials for Cryogenic Optoelectronics.” Journal of Microelectronics and Electronic Packaging 12 (4): 189–204. https://doi.org/10.4071/imaps.485.