ISSN 1551-4897
Articles in Vol. 12, Issue 4, 2015
Vol. 12, Issue 4, 2015
- Development of a Multifunctional Implantable Heart Monitoring DeviceAnh-Tuan T. NguyenFjodors TjulkinsKnut E. AasmundtveitNils HoivikLars HoffOle-Johannes GrymyrPer Steinar HalvorsenKristin Imenes
- Review of Devices, Packaging, and Materials for Cryogenic OptoelectronicsEivind BardalenMuhammad Nadeem AkramHelge MalmbekkPer Ohlckers
- High-Temperature Anisotropic Magnetoresistive (AMR) SensorsBharat B. PantLucky WithanawasamMike BohlingerMark LarsonBruce W. Ohme
- Process Optimization for 3-D IC AssemblyCharles G. WoychikSangil LeeScott McGrathSitaram Arkalgud
- Temperature Dependence of High Dielectric Strength Potting Materials for Medium Voltage Power ModulesChad B. O'NealMatthew FeurtadoJennifer StabachTy McNuttBrandon Passmore
- High-Temperature Reliability of Copper Wire-Bonded Packages Encapsulated with Mold Compounds Containing Sulfur CompoundsVarughese MathewSheila Chopin
- Fabrication and Characterization of Vibration and Wind Energy Harvesters Using Multilayer Free-Standing Piezoelectric Thick FilmsYang BaiHana HughesPavel TofelCarl MeggsTim W. Button
Woychik, Charles G., Sangil Lee, Scott McGrath, and Sitaram Arkalgud. 2015. “Process Optimization for 3-D IC Assembly.” Journal of Microelectronics and Electronic Packaging 12 (4): 219–25. https://doi.org/10.4071/imaps.474.