ISSN 1551-4897
Vol. 14, Issue 2, 2017April 01, 2017 EDT
Isothermal DSC Study of the Curing Kinetics of an Epoxy/Silica Composite for Microelectronics
Isothermal DSC Study of the Curing Kinetics of an Epoxy/Silica Composite for Microelectronics
Articles in Vol. 14, Issue 2, 2017
Vol. 14, Issue 2, 2017
- Isothermal DSC Study of the Curing Kinetics of an Epoxy/Silica Composite for MicroelectronicsLérys GranadoStefan KempaStefanie BremmertLaurence J. GregoriadesFrank BrüningEric AnglaretNicole Fréty
- New Ferrimagnetic Garnets for LTCC-Technology CirculatorsLilia QassymGérard CibienRichard LebourgeoisGilles MartinDorothée Colson
- Electrodeposited Copper-Graphite Composites for Low-CTE-Integrated Thermal StructuresShreya DwarakanathP. Markondeya RajKaya DemirVanessa SmetVenky SundaramRao Tummala
- Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit CarriersChristopher KaestleAarief Syed-KhajaJoerg Franke
- Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance MethodKazuki KammuriAtsushi MikiHiroki Takeuchi
Granado, Lérys, Stefan Kempa, Stefanie Bremmert, Laurence J. Gregoriades, Frank Brüning, Eric Anglaret, and Nicole Fréty. 2017. “Isothermal DSC Study of the Curing Kinetics of an Epoxy/Silica Composite for Microelectronics.” Journal of Microelectronics and Electronic Packaging 14 (2): 45–50. https://doi.org/10.4071/imaps.359903.