ISSN 1551-4897
Vol. 14, Issue 2, 2017April 01, 2017 EDT
Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers
Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers
Articles in Vol. 14, Issue 2, 2017
Vol. 14, Issue 2, 2017
- Isothermal DSC Study of the Curing Kinetics of an Epoxy/Silica Composite for MicroelectronicsLérys GranadoStefan KempaStefanie BremmertLaurence J. GregoriadesFrank BrüningEric AnglaretNicole Fréty
- New Ferrimagnetic Garnets for LTCC-Technology CirculatorsLilia QassymGérard CibienRichard LebourgeoisGilles MartinDorothée Colson
- Electrodeposited Copper-Graphite Composites for Low-CTE-Integrated Thermal StructuresShreya DwarakanathP. Markondeya RajKaya DemirVanessa SmetVenky SundaramRao Tummala
- Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit CarriersChristopher KaestleAarief Syed-KhajaJoerg Franke
- Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance MethodKazuki KammuriAtsushi MikiHiroki Takeuchi
Kaestle, Christopher, Aarief Syed-Khaja, and Joerg Franke. 2017. “Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers.” Journal of Microelectronics and Electronic Packaging 14 (2): 63–69. https://doi.org/10.4071/imaps.453827.