Thin Thermally Efficient ICECool Defense Semiconductor Power Amplifiers

Sumeer Khanna; Patrick McCluskey; Avram Bar-Cohen; Bao Yang; Michael Ohadi

doi:10.4071/imaps.456518

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ISSN 1551-4897

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Vol. 14, Issue 3, 2017

July 01, 2017 EDT

Thin Thermally Efficient ICECool Defense Semiconductor Power Amplifiers

Sumeer Khanna, Patrick McCluskey, Avram Bar-Cohen, Bao Yang, Michael Ohadi,

Thermal Management TechnologiesNear Junction Thermal Transport (NJTT)ThermoelectricsHeat Transport

ccby-nc-nd-4.0

• https://doi.org/10.4071/imaps.456518

Articles in Vol. 14, Issue 3, 2017

Vol. 14, Issue 3, 2017

Combustion Heat Meter
Zbigniew Magonski
Experimental Analysis of a Voice-Coil-Driven Jetting System for Micrograms Fluid Depositions in Electronics Assembly
Rajiv L. IyerDaryl L. Santos
Thin Thermally Efficient ICECool Defense Semiconductor Power Amplifiers
Sumeer KhannaPatrick McCluskeyAvram Bar-CohenBao YangMichael Ohadi
Combining Fine Line Photoimageable with Multi-Step Thick Film for Improved Circuit Density
Roland TackenDaniel MitcanJasper Nab

Journal of Microelectronics & Elect Pkg

Khanna, Sumeer, Patrick McCluskey, Avram Bar-Cohen, Bao Yang, and Michael Ohadi. 2017. “Thin Thermally Efficient ICECool Defense Semiconductor Power Amplifiers.” Journal of Microelectronics and Electronic Packaging 14 (3): 77–93. https://doi.org/10.4071/imaps.456518.

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